? semiconductor components industries, llc, 2006 january, 2006 ? rev. 4 1 publication order number: msc2295?bt1/d msc2295?bt1, msc2295?ct1 preferred device npn rf amplifier transistors surface mount features ? pb?free packages are available maximum ratings (t a = 25 c) rating symbol value unit collector?base voltage v (br)cbo 30 vdc collector?emitter voltage v (br)ceo 20 vdc emitter?base voltage v (br)ebo 5.0 vdc collector current ? continuous i c 30 madc thermal characteristics characteristic symbol max unit power dissipation p d 200 mw junction temperature t j 150 c storage temperature t stg ?55 to +150 c maximum ratings are those values beyond which device damage can occur. maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. if these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. electrical characteristics (t a = 25 c) characteristic symbol min max unit collector?base cutoff current (v cb = 10 vdc, i e = 0) i cbo ? 0.1 adc dc current gain (note 1) (v cb = 10 vdc, i c = ?1.0 madc) msc2295?bt1 msc2295?ct1 h fe 70 110 140 220 ? collector?gain ? bandwidth product (v cb = 10 vdc, i e = ?1.0 madc) f t 150 ? mhz reverse transistor capacitance (v ce = 10 vdc, i c = 1.0 madc, f = 10.7 mhz) c re ? 1.5 pf 1. pulse test: pulse width 300 s, d.c. 2%. http://onsemi.com preferred devices are recommended choices for future use and best overall value. sc?59 case 318d marking diagram 2 1 3 vx m vx = device code x= b or c m = date code* = pb?free package collector 3 2 base 1 emitter device package shipping ? ordering information msc2295?bt1 sc?59 3000/tape & ree l msc2295?ct1 3000/tape & ree l 3000/tape & ree l 3000/tape & ree l ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specification s brochure, brd8011/d. sc?59 (pb?free) sc?59 sc?59 (pb?free) msc2295?bt1g msc2295?ct1g (note: microdot may be in either location) *date code orientation may vary depending upon manufacturing location.
msc2295?bt1, msc2295?ct1 http://onsemi.com 2 package dimensions sc?59 case 318d?04 issue g e a1 b a e d 1 3 2 c l notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 2.4 0.094 0.95 0.037 0.95 0.037 1.0 0.039 0.8 0.031 mm inches scale 10:1 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* h e dim a min nom max min millimeters 1.00 1.15 1.30 0.039 inches a1 0.01 0.06 0.10 0.001 b 0.35 0.43 0.50 0.014 c 0.09 0.14 0.18 0.003 d 2.70 2.90 3.10 0.106 e 1.30 1.50 1.70 0.051 e 1.70 1.90 2.10 0.067 l 0.20 0.40 0.60 0.008 2.50 2.80 3.00 0.099 0.045 0.051 0.002 0.004 0.017 0.020 0.005 0.007 0.114 0.122 0.059 0.067 0.075 0.083 0.016 0.024 0.110 0.118 nom max h e on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800?282?9855 toll free usa/canada japan : on semiconductor, japan customer focus center 2?9?1 kamimeguro, meguro?ku, tokyo, japan 153?0051 phone : 81?3?5773?3850 msc2295?bt1/d literature fulfillment : literature distribution center for on semiconductor p.o. box 61312, phoenix, arizona 85082?1312 usa phone : 480?829?7710 or 800?344?3860 toll free usa/canada fax : 480?829?7709 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : http://onsemi.com order literature : http://www.onsemi.com/litorder for additional information, please contact your local sales representative.
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